🔹 NEXT-GEN ULTRA-THIN 0.2 MM PIPELINE (FUTURE CAPABILITY — LAUNCHING 2027)
Silicone Die-Cut Blank 0.2 mm | Advanced Low Z-Height Micro-Blanks
0.20±0.03 mm Thickness | 50 Shore A | 21 kN/m Tear | 8 MPa Tensile | -40°C to +200°C / +250°C (High-Temp)
Dimensions: Width 100 mm — Length 100 mm — Thickness 0.20±0.03 mm
❖ In-House Factory Converting Standard
Silicone Die-Cut Blank 0.2 mm Standard | FDA Grade (Clear) — R&D Pipeline for 2027
Status: Engineering Samples Available Upon Request (Advanced Micro-Electronics Testing).
Silicone Die-Cut Blank 0.2 mm Medical | Medical Grade (Clear) — R&D Pipeline for 2027
Silicone Die-Cut Blank 0.2 mm High-Temp | High-Temp Grade (Dark Red) — R&D Pipeline for 2027
High-Temp: Engineered for next-gen ultra-thin wearable medical sensors and localized electronics insulation.
NBR Die-Cut Blank 0.2 mm | Next-Gen Micro-Fuel & Oil Resistant Die-Cut Blanks
Dimensions: Width 100 mm — Length 100 mm — Thickness 0.20±0.03 mm
❖ In-House Factory Converting Standard
NBR Die-Cut Blank 0.2 mm Premium | High-Acrylonitrile (Black) — R&D Pipeline for 2027
Status: Designed for advanced micro-fuel metering diaphragms and sub-miniature aerospace UAV sensors.
EPDM Die-Cut Blank 0.2 mm | Next-Gen Ultra-Thin Weather & Dielectric Die-Cut Blanks
Dimensions: Width 100 mm — Length 100 mm — Thickness 0.20±0.03 mm
❖ In-House Factory Converting Standard
EPDM Die-Cut Blank 0.2 mm Premium | Weather & Dielectric (Black) — R&D Pipeline for 2027
Status: Engineered for ultra-low profile 5G/6G base station enclosures and EV battery cell micro-cushion substrates.